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The Applications of Spherical Quartz Powder

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It is what do you mean by it? Spherical Quartz Powder ? From quartz stone, the quartz sphere is made. Following purification, ultrafine grinding and calcination, phase, crystal form, and structure instantly change from solid state into liquid. Amorphous powder is made up of irregularly formed angular particle that have been transformed into regular spherical. Below are some key characteristics Spherical Quartz Powder
Spherical Quartz powder boasts smooth surfaces, high specific areas and excellent chemical stability. You can mix spherical Powder with resin to create a thin film. Higher amounts of quartz powder are better for electronic parts. The thermal conductivity will be lower. It also has a lower thermo expansion factor. Spherical powder has a 60% stress reduction compared to angular. Additionally, molding compounds made from spherical quartz powder have the highest stress concentration and strength. Spherical quartz powder has a very smooth surface. It is possible to extend the life expectancy of the mold’s service by up to one third due to its low friction coefficient and reduced wear.
Spherical quartz powder Spherical SiO2 Property
Other Titles Fused quartz, spherial quartz, spherical SiO2, silica
7631-86-9
Combination Formula SiO2
Motility 60.09
Appearance Powder White
Melting Point 1,600deg C (2,912deg F)
Solubility Into Water N/A
Density 2533 kg/m3
Purity 99.5-99.9%
10-30nm
Boling Point 2,230deg C (4,046deg F)
Particular Heat N/A
Aspects of Thermo Conductivity N/A
Thermal Expansion N/A
Young’s Modular N/A
Exact 59.9668 g/mol
Monoisotopic 59.967D
Spherical quartz powder Spherical siO2
The uses of Spherical Quartz powder
Many uses exist for spherical, powdered quartz. The most well-known is electronic packaging. Electronic packaging supports integrated circuits. As electronic circuits are becoming more complex, so do the requirements for packaging materials. To meet this demand, packaging materials are continuously optimized to be more efficient. The main three types of electronic packaging are substrate, glue, plastic and frame. One of the advantages to plastic packaging is its low cost, ease-of use and mass production. Plastic packaging accounts for 95% worldwide integrated circuits. %above. EMC is the primary plastic encapsulant. It contains over 95% of microelectronics.
1. High humidity, low pressure and high stress must all be tolerated by microelectronic packages. They also need to have excellent sealing properties. This is why epoxy molding materials must have inorganic fillers. The most widely used inorganic materials are silicon micropowder (or quartz micropowder). Microelectronics circuits that are large and complex have higher packaging requirements. EMC powder which supports EMC technology requires that quartz powder be the correct particle size. The purity of quartz powder is essential.
2. The sphere is made of silicon micropowder and has a great form that can be used for high-end integration systems. The temperature expansion coefficient, dielectric constant and stresses of sealants can be reduced by using this product. They are extremely resistant to weather, impact and compression. In addition to being widely used for electronic packaging, the spherical powder of Quartz can also be used extensively in the manufacture and application of high-end cosmetics, electronic inks, precision ceramics, and electronic inks. This powder can be used to fill in paint coatings.
The main supplier Spherical Quartz Powder
Advanced material Tech Co., Ltd. oxide powder We have over 12 years experience developing and researching chemicals products. Credit Card, T/T and West Union are all options. Trunnano sends goods to international customers via FedEx, DHL or airmail.
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